Abstract
An efficient integration scheme for a vertical cavity surface emission laser (VCSEL) on a silicon photonic circuit is introduced. A grating coupler fabricated on a tilted silicon membrane is used to couple the vertical emission of the VCSEL to the in-plane silicon waveguide with a high coupling efficiency and a low reflection back to the laser. Single-mode and single-polarization VCSELs at 1310nm wavelength band are flip-chip bonded on the silicon photonic chip. A coupling efficiency of -5.8dB is measured at the laser wavelength and a high optical power of 0.66mW is coupled to the silicon waveguide. Data transmission up to 10Gb/s with direct current modulation is realized using the integrated VCSEL. All the structures in the present coupling scheme are massively producible, and the hybrid integration of VCSELs relies on a standard high-accuracy flip-chip process with passive alignment.
PDF Article
More Like This
Cited By
You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.
Contact your librarian or system administrator
or
Login to access Optica Member Subscription