Abstract

We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high bandwidth density (100 Tbs/cm $^{2}$ ), and does not require optical alignment during packaging. These advantages make the flexible photonics platform a promising solution for chip-to-chip optical interconnects. We further report initial experimental characterizations of the flexible photonics platform fabricated using thermal nanoimprint patterning of glass waveguides and III–V die bonding.

© 2013 IEEE

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