Abstract
We present the design of a holey microstructured multicore optical fiber optimized to meet the
stringent requirements of chip-to-chip optical interconnects, namely, be compatible with high-speed vertical-cavity
surface-emission lasers, feature ultrahigh channel density, low crosstalk, and millimeter-bend resistance to sustain
the tight bends required on an electronic circuit board. We show that the shortcomings of the standard hexagonal
microstructure can be overcome by the use of seven-rod cores. We present the detailed simulation results of the
crosstalk and bend loss as a function of all the important microstructure parameters that led to the optimized
solution. We discuss the crosstalk dependence on the bending radius. To our knowledge, the multicore fiber presented
here achieves the highest normalized core density proposed to date, low enough crosstalk for meter-long transmission
at 10 Gb/s and bend loss < 0.02 dB/loop at a 1-mm bend radius. Maximizing space-division multiplexing, it
has the potential to allow Tb/s·cm
$^{2}$
optical
interconnects without the need for wavelength-division multiplexing.
© 2013 IEEE
PDF Article
More Like This
Cited By
You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.
Contact your librarian or system administrator
or
Login to access Optica Member Subscription