Abstract
We have developed novel optoelectronic packages and optical transmission
system using an optical connector with an external optical waveguide to
achieve low-loss chip-to-chip optical interconnections for computer systems.
In order to connect the package and the connector, we have also proposed a
socket as a coupling structure to realize an all passive alignment and high
coupling efficiency. We have demonstrated high-speed and error-free signal
transmission with four channels at 10-Gb/s/ch and up to 12-Gb/s/ch. Optical
input and output (I/O) interfaces, including optical devices and controller
integrated circuits (ICs), have been constructed onto the package surface by
conventional flip-chip mounting. The optoelectronic package has optical
waveguide holes (OWGHs) to pass optical signal vertically from a
vertical-cavity surface-emitting laser (VCSEL) and to a photodiode (PD). The
OWGHs consist of core and cladding material to enhance optical confinement.
The optical connector that is just set underneath the package with two guide
pins contains the thin-film polymer waveguide with 45$^{\circ}$-ended mirrors to bend the optical signal. Therefore, the shorter
optical coupling distance has achieved low-loss optical link without
microlenses between packages. We have also proposed an alignment structure
to easily enable passive alignment, which is based on existing land grid
array (LGA) packages and sockets clamping structures to simultaneously
improve cost-competitiveness and usability.
© 2010 IEEE
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