Abstract

Thermal and spatial-spectral imaging methods are used to investigate the soldering quality in high-power laser-bar devices. The temperature distribution and the wavelength profile across a driven laser bar correlate with the local thermal resistance between laser and cooler and, thus, with the uniformity of the solder layers. Measurements with a properly soldered and a deficiently soldered laser bar are made for the illustration and comparison of the methods.

© 2005 IEEE

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