Abstract

Two-dimensional (2-D) polymeric multimode waveguide arrays with two reflection-mirrors have been fabricated for optical interconnects between 2-D arrayed vertical-cavity surface-emitting lasers and detectors. Contact printing lithography was adopted for simple and low-cost process using ultraviolet-curable epoxy-based polymers. Fabricated waveguides were diced of the same size and stacked one by one with lateral positional errors less than ±20 µm . Two kinds of mirrors were fabricated: single-reflection mirror and double-reflection mirror. Double-reflected mirrors resulted in lower losses with 1.2 dB than single reflected mirrors with 2.1 dB. The average insertion losses of 16-channel arrayed waveguides with two single-reflection mirrors and with two double-reflection-mirrors were measured to be 6.1 and 4.4 dB for 6-cm-long waveguides at a wavelength of 830 nm, respectively. The crosstalk between the waveguides was less than -25 dB. The characteristics of the waveguide arrays are good enough for applications to optical interconnects.

© 2004 IEEE

Highly flexible polymeric optical waveguide for out-of-plane optical interconnects

Xinyuan Dou, Xiaolong Wang, Xiaohui Lin, Duo Ding, David Z. Pan, and Ray T. Chen
Opt. Express 18(15) 16227-16233 (2010)

Intra-system optical interconnection module directly integrated on a polymeric optical waveguide

B. S. Rho, S. H. Hwang, J. W. Lim, G. W. Kim, C. H. Cho, and W.-J. Lee
Opt. Express 17(3) 1215-1221 (2009)

Two-photon polymerization simulation and fabrication of 3D microprinted suspended waveguides for on-chip optical interconnects

Ricardo M. R. Adão, Tiago L. Alves, Christian Maibohm, Bruno Romeira, and Jana B. Nieder
Opt. Express 30(6) 9623-9642 (2022)

Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks

Guoqiang Li, Dawei Huang, Emel Yuceturk, Philippe J. Marchand, Sadik C. Esener, Volkan H. Ozguz, and Yue Liu
Appl. Opt. 41(2) 348-360 (2002)

Regenerative polymeric bus architecture for board-level optical interconnects

N. Bamiedakis, A. Hashim, R. V. Penty, and I. H. White
Opt. Express 20(11) 11625-11636 (2012)