Abstract
A mask-less and selective printing of conductor patterns
is of significant importance for all display applications.
Printing on structured surfaces such as microlenses or gratings
is a challenge. Typically used processes require thermal curing
to achieve the conductivity. This limits the applicability to
flexible display applications where low temperature processes
are preferred, especially for roll to roll (R2R) scale up. We
have used an approach of printing a catalyst containing ink,
followed by an electroless plating of copper. This paper details
the processes, microstructures and properties of highly
conductive and printed copper on patterned flat surfaces as well
as structures with micro-optic lens structures. A process has
been developed on surfaces with lens structures where the
conductor is required to be in the valley between the lenses and
between structures with narrow lines and narrow pitch. This is a
low temperature process, requiring a plating bath temperature of
< 45°C and thus very compatible with flexible substrates
and R2R processing.
© 2011 IEEE
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