Abstract
A high heat dissipation material (copper, Cu) was employed as the substrate for
top emission organic light-emitting diodes (TEOLEDs). The UV glue was spin-coated onto
the Cu substrate as the insulation layer to effectively improve Cu surface roughness and
reduce process complexity. From the optoelectronic results, the optimized device with
the Cu substrate shows the maximum luminance of 14110 $\hbox{cd/m} ^{2}$ and luminance
efficiency of 7.14 cd/A. The surface and junction temperatures are measured to discuss
the heat-dissipating effect on device performance. From the results, TEOLED fabricated
on a Cu substrate has lower junction (55.34 $^{\circ}\hbox{C}$) and surface (25.7 $
^{\circ}\hbox{C}$) temperatures, with the lifetime extended seven times. We employed Cu
foil as the substrate for flexible TEOLED with maximum luminance of 10310 $\hbox{cd/m}
^{2}$ and luminance efficiency of 7.3 cd/A obtained.
© 2010 IEEE
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