Abstract
The thermal properties of a flip-chip light-emitting diode (FCLED)
chip-on-board (COB) with diamond-like carbon (DLC) heat-spreading
layers are investigated. The temperature-dependent performance of
the COB packages with and without DLC heat-spreading layers at the
LED and metal core printed circuit board sites are studied. Results show that the device junction
temperature and thermal conductivity of the COB package with DLC heat-spreading
layers (DLC package) are less than those of the COB package without
DLC heat-spreading layers (regular package). For the steady state
of light intensity, the mean of light intensity drop for 12 tested
packages of DLC package was improved by 6.1% after 3 hours of burn-in
compared with that of the regular package.
© 2015 IEEE
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