Estimation of maximum temperature and thermal crosstalk between two active elements in a PIC: development of a thermal equivalent circuit

Shusmitha Kyatam; Stanislav I. Maslovski; Hugo Neto; Luis N. Alves; Joana C. Mendes

doi:10.1364/AO.397684

Applied Optics
Vol. 59,
Issue 28,
pp. 8866-8877
(2020)
•https://doi.org/10.1364/AO.397684

Estimation of maximum temperature and thermal crosstalk between two active elements in a PIC: development of a thermal equivalent circuit

Shusmitha Kyatam, Stanislav I. Maslovski, Hugo Neto, Luis N. Alves, and Joana C. Mendes

Not Accessible

Your library or personal account may give you access

Get PDF
Email
Share
Get Citation
Copy Citation Text
Shusmitha Kyatam, Stanislav I. Maslovski, Hugo Neto, Luis N. Alves, and Joana C. Mendes, "Estimation of maximum temperature and thermal crosstalk between two active elements in a PIC: development of a thermal equivalent circuit," Appl. Opt. 59, 8866-8877 (2020)

Export Citation
- BibTex
- Endnote (RIS)
- HTML
- Plain Text
Citation alert
Save article

Check for updates

Related Topics
Table of Contents Category
- Integrated Optics
Optics & Photonics Topics
?

The topics in this list come from the Optics and Photonics Topics applied to this article.

About this Article
History
- Original Manuscript: May 26, 2020
- Revised Manuscript: August 28, 2020
- Manuscript Accepted: September 1, 2020
- Published: September 29, 2020

Abstract

The operating temperature plays a key role in the performance and lifetime of photonic integrated circuits (PICs). Miniaturization and increasing heat dissipation promote thermal crosstalk effects and pose additional challenges to the PIC designer. The European Photonics Industry Consortium recommends thermal modeling during design phase. However, a fully numerical optimization of a particular layout requires an unrealistically large number of simulations. Here, we propose a compromise approach: a set of carefully chosen simulations are performed with a multi-physics software. The obtained results are used to derive a linearized equivalent thermal circuit that can be used to maximize the power levels and to minimize the distance between the chosen components while guaranteeing the absence of a thermal crosstalk. For simplification, this model is derived considering a PIC with only two active components. Other parameters are varied, such as the material of the holder (silicon or diamond) and the layer of epoxy that is used to attach the PIC to the holder. The obtained circuit is used to determine the maximum dissipated power or the minimum distance between the components while keeping some predetermined specifications. The model can be extended to contain more elements or to include transient analysis of the temperature distribution.

Full Article | PDF Article

More Like This

Thermal management of photonic integrated circuits: impact of holder material and epoxies

Shusmitha Kyatam, Debarati Mukherjee, Hugo Neto, and Joana C. Mendes
Appl. Opt. 58(22) 6126-6135 (2019)

Thermal vulnerability detection in integrated electronic and photonic circuits using infrared thermography

Bilal Hussain, Bushra Jalil, Maria Antonietta Pascali, Muhammad Imran, Giovanni Serafino, Davide Moroni, and Paolo Ghelfi
Appl. Opt. 59(17) E97-E106 (2020)

Reducing thermal crosstalk in ten-channel tunable slotted-laser arrays

I. Mathews, A. Abdullaev, S. Lei, R. Enright, M. J. Wallace, and J. F. Donegan
Opt. Express 23(18) 23380-23393 (2015)

Previous Article Next Article

Cited By

You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Figures (9)

You do not have subscription access to this journal. Figure files are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Tables (3)

You do not have subscription access to this journal. Article tables are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Equations (13)

You do not have subscription access to this journal. Equations are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Epoxy name	Thermal conductivity $W \cdot (m K)^{- 1}$	Curing temperature(°C)
Epoxy name	Thermal conductivity $W \cdot (m K)^{- 1}$	Max	Min
NOA60	0.17	UV^b
EPO-TEK EJ2108	4	150	23
EPO-TEK EK1000	12.6–35.5	200	150

			Maximum temperature increase (%)							Minimum temperature between DFBs increase (%)
	Epoxy		Distance between DFBs (µm)							Distance between DFBs (µm)
Power (W)	Name	Thickness (µm)	One DFB	150	250	350	500	650	800	150	250	350	500	650	800
0.46	NOA60	1	3.6	5.9	5.5	5.0	4.6	4.2	4.0	6.7	6.7	6.2	5.6	4.8	4.1
		5	8.5	14.7	14.1	13.2	12.2	11.4	10.7	16.6	16.6	16.0	15.0	13.7	12.5
		10	11.3	20.1	19.3	18.3	17.1	16.1	15.3	22.5	22.5	22.1	21.0	19.7	18.2
		20	3.3	5.3	4.9	4.5	4.1	3.7	3.6	6.0	5.9	5.4	4.9	4.2	3.5
	EJ2108	50	5.7	9.5	8.9	8.3	7.5	7.0	6.6	10.8	10.6	10.0	9.3	8.2	7.2
		100	8.0	13.6	13.0	12.1	11.2	10.4	9.8	15.4	15.3	14.7	13.8	12.6	11.2
		20	0.6	0.8	0.8	0.7	0.6	0.6	0.6	0.9	1.0	0.9	0.7	0.6	0.5
	EK1000	50	1.3	1.9	1.8	1.6	1.5	1.3	1.3	2.3	2.1	2.0	1.8	1.4	1.1
		100	2.2	3.4	3.2	2.9	2.6	2.4	2.3	4.0	3.9	3.4	3.1	2.6	2.1
1.66		1	8.8	14.1	13.1	12.3	11.2	10.4	9.9	18.4	19.2	18.8	18.0	15.9	14.2
	NOA60	5	20.9	35.4	33.9	32.3	30.0	28.1	26.5	45.3	48.2	49.1	48.6	46.0	42.5
		10	28.0	48.3	46.8	44.9	42.2	39.8	37.7	61.2	65.8	67.7	68.3	65.9	62.6
		20	7.9	12.6	11.7	10.9	10.0	9.2	8.8	16.4	17.1	16.7	15.9	13.9	12.4
	EJ2108	50	13.8	22.7	21.4	20.2	18.5	17.2	16.2	29.3	30.9	31.0	29.8	27.4	24.8
		100	19.5	32.8	31.3	29.7	27.5	25.7	24.2	42.0	44.5	45.3	44.8	42.0	38.7
		1	1.3	2.0	1.8	1.7	1.5	1.4	1.4	2.6	2.6	2.9	2.3	1.8	1.6
	EK1000	5	3.0	4.6	4.2	3.9	3.6	3.3	3.2	6.1	6.3	6.2	5.4	4.5	3.9
		10	5.3	8.2	7.5	7.0	6.4	5.9	5.7	10.8	10.9	10.7	10.0	8.6	7.5

		$R_{1} = R_{2} (K / W)$						$R_{3} (K / W)$						$α_{1} = α_{2} (K / W)$
Epoxy		Distance between DFBs (µm)						Distance between DFBs (µm)						Distance between DFBs (µm)
Name	Thickness (µm)	150	250	350	500	600	800	150	250	350	500	650	800	150	250	350	500	650	800
NOA60	1	18.07	19.51	20.44	21.25	21.77	22.06	4.55	3.09	2.18	1.32	0.81	0.52	9.57	7.61	6.16	4.54	3.45	2.62
	5	18.86	20.71	22.10	23.52	24.54	25.29	8.92	7.05	5.67	4.21	3.19	2.44	14.53	12.37	10.69	8.83	7.45	6.31
	10	19.05	21.01	22.58	24.23	25.42	26.44	11.68	9.70	8.15	6.47	5.26	4.27	17.51	15.20	13.41	11.57	10.08	8.85
	20	18.00	19.37	20.28	21.04	21.49	21.76	4.25	2.85	1.96	1.16	0.70	0.44	9.31	7.26	5.78	4.24	3.19	2.41
EJ2108	50	18.50	20.14	21.30	22.40	23.11	23.59	6.26	4.60	3.46	2.32	1.60	1.12	11.67	9.52	7.95	6.22	4.99	4.02
	100	18.82	20.63	21.99	23.35	24.30	24.98	8.34	6.51	5.17	3.77	2.81	2.14	13.97	11.74	10.11	8.29	6.92	5.81
	20	17.11	18.07	18.64	19.00	19.19	19.28	2.31	1.32	0.77	0.36	0.17	0.09	6.79	4.89	3.66	2.34	1.57	1.04
EK1000	50	17.38	18.46	19.12	19.57	19.82	19.94	2.76	1.65	1.01	0.51	0.26	0.15	7.42	5.46	4.15	2.79	1.93	1.34
	100	17.69	18.91	19.69	20.28	20.62	20.80	3.41	2.16	1.40	0.77	0.43	0.25	8.28	6.26	4.85	3.43	2.47	1.80

Epoxy name	Thermal conductivity $W \cdot (m K)^{- 1}$	Curing temperature(°C)
Epoxy name	Thermal conductivity $W \cdot (m K)^{- 1}$	Max	Min
NOA60	0.17	UV^b
EPO-TEK EJ2108	4	150	23
EPO-TEK EK1000	12.6–35.5	200	150

			Maximum temperature increase (%)							Minimum temperature between DFBs increase (%)
	Epoxy		Distance between DFBs (µm)							Distance between DFBs (µm)
Power (W)	Name	Thickness (µm)	One DFB	150	250	350	500	650	800	150	250	350	500	650	800
0.46	NOA60	1	3.6	5.9	5.5	5.0	4.6	4.2	4.0	6.7	6.7	6.2	5.6	4.8	4.1
		5	8.5	14.7	14.1	13.2	12.2	11.4	10.7	16.6	16.6	16.0	15.0	13.7	12.5
		10	11.3	20.1	19.3	18.3	17.1	16.1	15.3	22.5	22.5	22.1	21.0	19.7	18.2
		20	3.3	5.3	4.9	4.5	4.1	3.7	3.6	6.0	5.9	5.4	4.9	4.2	3.5
	EJ2108	50	5.7	9.5	8.9	8.3	7.5	7.0	6.6	10.8	10.6	10.0	9.3	8.2	7.2
		100	8.0	13.6	13.0	12.1	11.2	10.4	9.8	15.4	15.3	14.7	13.8	12.6	11.2
		20	0.6	0.8	0.8	0.7	0.6	0.6	0.6	0.9	1.0	0.9	0.7	0.6	0.5
	EK1000	50	1.3	1.9	1.8	1.6	1.5	1.3	1.3	2.3	2.1	2.0	1.8	1.4	1.1
		100	2.2	3.4	3.2	2.9	2.6	2.4	2.3	4.0	3.9	3.4	3.1	2.6	2.1
1.66		1	8.8	14.1	13.1	12.3	11.2	10.4	9.9	18.4	19.2	18.8	18.0	15.9	14.2
	NOA60	5	20.9	35.4	33.9	32.3	30.0	28.1	26.5	45.3	48.2	49.1	48.6	46.0	42.5
		10	28.0	48.3	46.8	44.9	42.2	39.8	37.7	61.2	65.8	67.7	68.3	65.9	62.6
		20	7.9	12.6	11.7	10.9	10.0	9.2	8.8	16.4	17.1	16.7	15.9	13.9	12.4
	EJ2108	50	13.8	22.7	21.4	20.2	18.5	17.2	16.2	29.3	30.9	31.0	29.8	27.4	24.8
		100	19.5	32.8	31.3	29.7	27.5	25.7	24.2	42.0	44.5	45.3	44.8	42.0	38.7
		1	1.3	2.0	1.8	1.7	1.5	1.4	1.4	2.6	2.6	2.9	2.3	1.8	1.6
	EK1000	5	3.0	4.6	4.2	3.9	3.6	3.3	3.2	6.1	6.3	6.2	5.4	4.5	3.9
		10	5.3	8.2	7.5	7.0	6.4	5.9	5.7	10.8	10.9	10.7	10.0	8.6	7.5

Abstract

Cited By

Figures (9)

Tables (3)

Equations (13)

Applied Optics