Abstract

An argon ion laser and an ir microscope have been combined to function as a unique combination for non-destructively testing the quality of bonded connections in microcircuits of the beam lead type. A microcircuit is heated with the focused beam from the laser and scanned with the microscope to determine the temperature pattern. Nonbonded microcircuits, poorly bonded microcircuits, and a multiplicity of adjacent poorly bonded leads have been detected by using this scanner. Preliminary results have indicated that a single nonbonded connection in an array of well bonded connections may be detected. An analytical check by computer analysis demonstrates the validity of the experimental data.

© 1970 Optical Society of America

Scanned Laser Infrared Microscope

B. Sherman and J. F. Black
Appl. Opt. 9(4) 802-809 (1970)

Infrared Techniques for Measuring Temperature and Related Phenomena of Microcircuits

D. D. Griffin
Appl. Opt. 7(9) 1749-1756 (1968)

Design Considerations for an Infrared Flying-Spot Telescope

A. D. Shulman
Appl. Opt. 9(11) 2505-2510 (1970)

The Remote Detection of Clear Air Turbulence by Infrared Radiation

R. W. Astheimer
Appl. Opt. 9(8) 1789-1797 (1970)

Some Aspects of Multiple-Beam Interference Techniques in Digital Data Recording

L. L. Blackmer, A. P. VanKerkhove, R. E. Baldwin, and K. F. Stultz
Appl. Opt. 9(12) 2753-2761 (1970)