Integration of alumina-phosphate glass with cobalt-doped magnesium
aluminate structure using a hot embossing technique for microlaser
development

Tanvi Karpate; Tanvi Karpate; Ireneusz Kujawa; Rafał Kasztelanic; Rafał Kasztelanic; Ryszard Stępień; Jarosław Kisielewski; Krzysztof Kopczyński; Jarosław Młyńczak

doi:10.1364/AO.414301

Applied Optics
Vol. 60,
Issue 5,
pp. 1456-1462
(2021)
•https://doi.org/10.1364/AO.414301

Integration of alumina-phosphate glass with cobalt-doped magnesium aluminate structure using a hot embossing technique for microlaser development

Tanvi Karpate, Ireneusz Kujawa, Rafał Kasztelanic, Ryszard Stępień, Jarosław Kisielewski, Krzysztof Kopczyński, and Jarosław Młyńczak

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Tanvi Karpate, Ireneusz Kujawa, Rafał Kasztelanic, Ryszard Stępień, Jarosław Kisielewski, Krzysztof Kopczyński, and Jarosław Młyńczak, "Integration of alumina-phosphate glass with cobalt-doped magnesium aluminate structure using a hot embossing technique for microlaser development," Appl. Opt. 60, 1456-1462 (2021)

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Abstract

In this work, the technique of hot embossing has been applied for the bonding of alumina-phosphate (PAL) glass with cobalt-doped magnesium aluminate (MALO) crystals. The application of the hot embossing technique for bonding of PAL/MALO is a competitive method, as compared to the existing thermobonding techniques. The obtained PAL/MALO interfaces show high quality, similar to what is currently achievable with other, more expensive traditional methods. The interfaces of the bonded samples have been successfully tested for strength and damage thresholds. The damage threshold is estimated to be around ${{4.5 \!-\! 7.9}}\;{\rm{kW/c}}{{\rm{m}}^2}$. Therefore, microlasers can be developed based on the obtained components.

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$P_{2} O_{5}$	$A l_{2} O_{3}$	$B_{2} O_{3}$	$Y b_{2} O_{3}$	$L i_{2} O$	$E r_{2} O_{3}$	$S b_{2} O_{3}$
64.58	6.95	11.92	6.95	8.96	0.36	0.28 mol.%
65.78	5.09	5.95	19.66	1.92	1.01	0.59 wt.%

Characteristic	Value
Refractive index $n_{D}$ (at $λ = 589.3 n m$ )	1.5369
Linear expansion coefficient $α$ [ $1 0^{- 6} K^{- 1}$ ] for the temperature range: 20°C–300°C 20°C–450°C	7.37.5
Young’s module E [GPa]	70
Transformation temperature Tg [°C] for $\log η = 13.4$	$545 \pm 4$
Dilatometric softenig point DSP [°C] for $\log η = 11.0$	$616 \pm 3$
The heating microscope of Leitz characteristic temperatures [°C] :- glass softening point for $\log η = 9.0$ - sphere temperature point for $\log η = 6.0$ - half-sphere point for $\log η = 4.0$ - spreading point for $\log η = 2.0$	$700 \pm 5$ $830 \pm 5$ $920 \pm 5$ $990 \pm 5$
Thermal conductivity coefficient [ $W \cdot m^{- 1} K^{- 1}$ ]	$0.75 \pm 0.03$
Cp [ $J \cdot k g^{- 1} K^{- 1}$ ]	$830 \pm 15$
Density d [ $g / {c m}^{3}$ ]	2.84

MALO	Content of ${C o}^{2 +}$ (in the Crucible) %	Info NOTE
CGN 333	0.085	GROWTH ON THE IRIDIUM WIRE
CGN 345	0.060	GROWTH ON CRYSTAL PLATE–orientation (111)
CGN 346	0.110	GROWTH ON CRYSTAL PLATE–orientation (111)
CGN 347	0.135	GROWTH ON CRYSTAL PLATE–orientation (111)
CGN 348	0.160	GROWTH ON CRYSTAL PLATE–orientation (111)
CGN 349	0.185	GROWTH ON CRYSTAL PLATE–orientation (111)
CGN 352	0.350	GROWTH ON CRYSTAL PLATE–orientation (111)

Property	Value
Refractive index at $λ = 589.3 n m$ $n_{D}$ ^a	$\sim 1.67$
Linear expansion coefficient α for the thermal range: 20°C–300°C [ $1 0^{- 6} K^{- 1}$ ]	8.0
Young’s module E [GPa]	$\sim 0.0003$
Melting temperature [°C]	$2140 \pm 2$
Thermal conductivity coefficient [ $W \cdot m^{- 1} K^{- 1}$ ]	$9.3 \pm 2.5$
Cp [ $J \cdot k g^{- 1} K^{- 1}$ ]	$290 \pm 15$
Density d [ $g / {c m}^{3}$ ]^*	$\sim 3.50$

Dataset	PAL-83/CGN 347 A	PAL-83/CGN 349B	PAL-83/CGN 333B	PAL-83/CGN 345 A	PAL-83/CGN 333 A	PAL-83/CGN 346 A	PAL-83/CGN 347B
Cleaning time [h]	1	2	10	4	9	3	16
Cleaning temperature [°C]	570	492	570	570	570–575	570	570
Time the first STAGE of bonding [h]	10	4	8	4	14	7	24
Temperature of the first STAGE of bonding [°C]	637	620	620	620	600–620	600–620	630–635
Time the second STAGE of bonding [h]	10	10	21	12	10	17	34
Temperature of the second STAGE of bonding [°C]	642–645	635	635	635–655	635	635	653
Strengthening time of composite bonding [h]	12	12	6	48	15	6	15
Composite bonding strengthening temperature [°C]	649	650–653	653	653–667	645–667	637	630–635
Annealing of composite bonding	Yes! 0.65°C/min(600–65°C)	Yes! 0.65°C/min(600–65°C)	Yes! 0.50°C/min(600–35°C)	Yes! 0.50°C/min(600–35°C)	Yes! 0.50°C/min(600–35°C)	Yes! 0.65°C/min(600–65°C)	Yes! 0.50°C/min(600–35°C)
Stress relief cycle label	K-20	K-30	L-30	L-10	L-20	K-10	L-40
Total time of BONDING [h]	$\sim 47$	$\sim 42$	$\sim 64$	$\sim 87$	$\sim 67$	$\sim 47$	$\sim 108$
Force [N]	9	17	41	23	9	23	9
Pressing time [h]	3	2	2	2	2	1	1
MALO plate thickness [mm]	0.192	0.148	0.310	0.750	0.203	0.217	0.288
Symbol of MALO plate	347 A	349B	333B	345 A	333 A	346 A	347B
Dose of $C o^{2 +}$ [% $_{a t}$ ] in MALO	0.135	0.185	0.085	0.060	0.085	0.110	0.135
COMMENTS:	Discontinuities and caverns	Discontinuities and caverns	Crack on MALO side	Single cavern	Slight defects	Slight defects	No obvious defects

Tanvi Karpate	https://orcid.org/0000-0002-1707-2129
Rafał Kasztelanic	https://orcid.org/0000-0002-6901-4641
Jarosław Młyńczak	https://orcid.org/0000-0002-0823-9302

	Normalized Reflection Intensity
	R1	R2	R3
Theory	0.87	0.045	1
Experiment	0.87	0.040	1

	Normalized Reflection Intensity
	R1	R2	R3
Theory	0.87	0.045	1
Experiment	0.87	0.040	1

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Applied Optics