Manufacture and characterization of optical coatings with incorporated copper island films

Mario Held; Olaf Stenzel; Steffen Wilbrandt; Norbert Kaiser; Andreas Tünnermann

doi:10.1364/AO.51.004436

Manufacture and characterization of optical coatings with incorporated copper island films

Mario Held, Olaf Stenzel, Steffen Wilbrandt, Norbert Kaiser, and Andreas Tünnermann

Applied Optics
Vol. 51,
Issue 19,
pp. 4436-4447
(2012)
•https://doi.org/10.1364/AO.51.004436

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Mario Held, Olaf Stenzel, Steffen Wilbrandt, Norbert Kaiser, and Andreas Tünnermann, "Manufacture and characterization of optical coatings with incorporated copper island films," Appl. Opt. 51, 4436-4447 (2012)

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Related Topics
Table of Contents Category
- Thin Films
Optics & Photonics Topics
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The topics in this list come from the OSA Optics and Photonics Topics applied to this article.
Previously assigned OCIS codes
- Optical materials (160.4670)
- Multilayers (230.4170)
- Surface plasmons (240.6680)
- Metallic, opaque, and absorbing coatings (310.3915)
- Multilayer design (310.4165)
- Subwavelength structures, nanostructures (310.6628)

About this Article
History
- Original Manuscript: April 19, 2012
- Manuscript Accepted: May 4, 2012
- Published: June 27, 2012

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Abstract

Copper island films have been prepared by thermal evaporation in vacuum and characterized by in situ as well as ex situ spectrophotometry. The parallel investigation of the island morphology by means of transmission electron microscopy allowed us to establish a clear correlation between film structure and optical properties. The effective optical constants of the copper island films could be determined by means of a fit of their ex situ transmission and reflection spectra. The effective optical constants have been used for designing and preparing optical multilayer coatings applicable for attenuator or color filter specifications. Measured characteristics of the multilayer coatings are in very good agreement with the calculated spectra.

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Sample Number $j$	Quartz Monitor Signal for Copper Fraction [a.u.]	CIF Thickness $d_{CIF}$ $d_{CIF} = 2 d_{{Al}_{2} O_{3}} + d_{Cu}$ [nm]	Copper Filling Factor $p$ $p = 100 % \frac{d_{Cu}}{2 d_{{Al}_{2} O_{3}} + d_{Cu}}$ [vol.%]
1	200	13.5	12
2	400	15	22
3	600	16.5	30
4	800	18	37
5	1000	19.5	43
6	1200	21	48
7	5000	37.9	—

Substrate
Attenuator	Blue Transmission Filter
${TiO}_{2}$ : 52 nm	$H$ : 75.8 nm
Film 1: 13.5 nm	$L$ : 101 nm
Air	$H$ : 65.5 nm
	$L$ : 104.2 nm
	Film 2: 15.0 nm
	$H$ : 36.2 nm
	$L$ : 123.4 nm
	Film 4: 18.0 nm
	$L$ : 107.2 nm
	$H$ : 78 nm
	Air

	Material
Deposition Parameter	${TiO}_{2}$	${Al}_{2} O_{3}$	Cu
Evaporation technique	e-gun	e-gun	thermal
Start pressure [mbar]	$2.0 \cdot 10^{- 5}$	$2.0 \cdot 10^{- 5}$	$2.0 \cdot 10^{- 5}$
Working pressure [mbar]	$4.2 \cdot 10^{- 5}$	$3.5 \cdot 10^{- 5}$	$1.5 \cdot 10^{- 5}$
Gas flow $O_{2}$ [sccm]	85	0	0
Temperature [°C]	90	90	90
Rate [ $nm / s$ ]	0.4	0.3	0.15

	Material
Deposition Parameter	${SiO}_{2}$	${Ta}_{2} O_{5}$	${Al}_{2} O_{3}$	Cu
Evaporation technique	e-gun	e-gun	e-gun	thermal
Start pressure [mbar]	$2.0 \cdot 10^{- 5}$	$2.0 \cdot 10^{- 5}$	$2.0 \cdot 10^{- 5}$	$2.0 \cdot 10^{- 5}$
Working pressure [mbar]	$3.5 \cdot 10^{- 5}$	$2.0 \cdot 10^{- 5}$	$3.5 \cdot 10^{- 5}$	$1.5 \cdot 10^{- 5}$
Gas flow $O_{2}$ [sccm]	34	55	0	0
Temperature [°C]	90	90	90	90
Rate [ $nm / s$ ]	0.3	1.0	0.3	0.15
Ion assistance	Yes	Yes	No	No
Anode current [A]	3	3
Neutralizer voltage [V]	23	23
Neutralizer current [A]	23	23

Sample Number $j$	Quartz Monitor Signal for Copper Fraction [a.u.]	CIF Thickness $d_{CIF}$ $d_{CIF} = 2 d_{{Al}_{2} O_{3}} + d_{Cu}$ [nm]	Copper Filling Factor $p$ $p = 100 % \frac{d_{Cu}}{2 d_{{Al}_{2} O_{3}} + d_{Cu}}$ [vol.%]
1	200	13.5	12
2	400	15	22
3	600	16.5	30
4	800	18	37
5	1000	19.5	43
6	1200	21	48
7	5000	37.9	—

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