High-performance coatings for micromechanical mirrors

Alexandre Gatto; Minghong Yang; Norbert Kaiser; Jörg Heber; Jan Uwe Schmidt; Thilo Sandner; Harald Schenk; Hubert Lakner

doi:10.1364/AO.45.001602

Applied Optics
Vol. 45,
Issue 7,
pp. 1602-1607
(2006)
•https://doi.org/10.1364/AO.45.001602

High-performance coatings for micromechanical mirrors

Alexandre Gatto, Minghong Yang, Norbert Kaiser, Jörg Heber, Jan Uwe Schmidt, Thilo Sandner, Harald Schenk, and Hubert Lakner

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Alexandre Gatto, Minghong Yang, Norbert Kaiser, Jörg Heber, Jan Uwe Schmidt, Thilo Sandner, Harald Schenk, and Hubert Lakner, "High-performance coatings for micromechanical mirrors," Appl. Opt. 45, 1602-1607 (2006)

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Abstract

High-performance coatings for micromechanical mirrors were developed. The high-reflective metal systems can be integrated into the technology of MOEMS, such as spatial light modulators and microscanning mirrors from the near-infrared down to the vacuum-ultraviolet spectral regions. The reported metal designs permit high optical performances to be merged with suitable mechanical properties and fitting complementary metal-oxide semiconductor compatibility.

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λ₀ (nm)	Fluence Resistance Required	R (0°) at λ₀ Required (%)	Material and Design	Substrate	Total Thickness (nm)	Coating Technique	R[0°] at λ₀ Achieved (%)
1064	2W∕mm²	99	Ag∕Au	Si	< 100	Sputter	99
532	2W∕mm²	99	Al	Si	< 100	Sputter	–
308	20–100 μJ∕cm²	99	Al	Si	< 100	Sputter	–
248	20–100 μJ∕cm²	99	Al	Si	< 100	Sputter	–
193	20–100 μJ∕cm²	90	Al protected	Si	< 150	Evaporation	91
157	20–100 μJ∕cm²	90	Al protected	Si	< 150	Evaporation	89

Coating System	Deposition Technique	R at λ = 193 nm (%)	R at λ = 157 nm (%)
Al alloy	dc magnetron sputtering	75–80	–
Al	Evaporation	88	73.4
Al	dc magnetron sputtering	88	71
Al∕AlF₃	Evaporation	90.9	89
Al∕MgF₂	Evaporation	91.6	88
Al∕LaF₃	Evaporation	84	88.4
Al∕Al₂O₃	Evaporation	90.8	–
Al∕SiO₂	Evaporation	89.2	60

	Roughness	Reflectivity before RIE	Resist Adhesion	RIE Pattern Transfer	Reflectivity after RIE	Interest
AlMgSi	+	+	++	+++	– (<80%)	Low
Al	++	++	++	+++	++ (almost 90%)	High
Al + AlF₃	++	++	++	++	++ (85–90%)	High
Al + LaF₃	++	++	++	–	+ (85–90%)	Medium
Al + MgF₂	++	++	–	–	+ (85–90%)	Very low
Al + SiO₂	++	++	++	++	+++ (#90%)	Very high
Al + Al₂O₃	++	++	++	+++	++ (#90%)	Very high

λ₀ (nm)	Fluence Resistance Required	R (0°) at λ₀ Required (%)	Material and Design	Substrate	Total Thickness (nm)	Coating Technique	R[0°] at λ₀ Achieved (%)
1064	2W∕mm²	99	Ag∕Au	Si	< 100	Sputter	99
532	2W∕mm²	99	Al	Si	< 100	Sputter	–
308	20–100 μJ∕cm²	99	Al	Si	< 100	Sputter	–
248	20–100 μJ∕cm²	99	Al	Si	< 100	Sputter	–
193	20–100 μJ∕cm²	90	Al protected	Si	< 150	Evaporation	91
157	20–100 μJ∕cm²	90	Al protected	Si	< 150	Evaporation	89

Coating System	Deposition Technique	R at λ = 193 nm (%)	R at λ = 157 nm (%)
Al alloy	dc magnetron sputtering	75–80	–
Al	Evaporation	88	73.4
Al	dc magnetron sputtering	88	71
Al∕AlF₃	Evaporation	90.9	89
Al∕MgF₂	Evaporation	91.6	88
Al∕LaF₃	Evaporation	84	88.4
Al∕Al₂O₃	Evaporation	90.8	–
Al∕SiO₂	Evaporation	89.2	60

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Applied Optics