An integrated three-dimensional optical multilayer system for optical data communications is presented. It is based on the use of free-space optical light propagation and combines two integration principles, namely, planar and stacked integration. The combination of both integration schemes aims at a maximal design flexibility for complex geometric layouts. On the other hand, packaging issues that stem from assembly and tolerance have to be considered. Here we describe the basic concept and demonstrate the implementation of an optical interface module in a processor-memory bus.
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