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Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique

Wen-Kai Kuo, Deng-Tzung Tang, Chien-Jang Wu, and Thomson Lai

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Abstract

A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.

© 2005 Optical Society of America

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