Abstract

Decreasing the system volume for optoelectronic (OE) planar systems is achieved by advancing computer-aided design of OE multichip modules (MCM’s). It is shown that in order to minimize the volume in an OE MCM, it is necessary to minimize the maximum interconnect distance. To achieve this, we have developed placement algorithms based on the constraints of a given irregular interconnect pattern. Results are given for a twin-butterfly network for two general physical models: a transmissive MCM and a reflective MCM. We then show three different types of hologram design that can be used to implement the interconnect array. These elements are for reconstruction in the near field and are fabricated by direct-write electron-beam lithography. Both simulated and experimental reconstructions are demonstrated.

© 1994 Optical Society of America

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