Abstract

A nondestructive method is presented for the inspection of uniformity and measurement of the thickness of transparent film deposits made on dielectric substrates. Using this technique it is possible to evaluate film deposits with a refractive index close to that of the substrate and with thickness that are 〉1 μm. The sensitivity and region of usefulness of this procedure are discussed with the parameters involved. Substrates can be of poor optical quality.

© 1986 Optical Society of America

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