We investigate the experimental limitations of the maximum resolution that can be achieved in far-field subsurface thermal imaging with a numerical aperture increasing lens. High-resolution thermal imaging has applications in failure analysis of Si integrated circuits.

© 2005 Optical Society of America

PDF Article


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription