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Conferences > OIC > 2016 > WB > WB.7

Stress analysis of SiOx :C Films Deposited by HMDSO/O2 Plasma Polymerization

Bo-Yi Lin, Wei-Bo Liao, Cheng-Chung Jaing, Ya-Chen Chang, Ching-Long Cheng, Cheng-Chung Lee, and Chien-Cheng Kuo

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Abstract

SiOx:C plasma polymer film can effectively reduce the stress of the multilayer film by adjusted process parameters. The average transmittance in visible light is 90% and the stress of the multilayers was reduced 63.5 %.

© 2016 Optical Society of America

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