SiO2 Film Thickness Determination on Silicon Using Dual-Angle Imaging

Jennifer D. T. Kruschwitz; Roy S. Berns

doi:10.1364/OIC.2016.ThB.7

Optical Interference Coatings 2016
OSA Technical Digest (online) (Optica Publishing Group, 2016),
paper ThB.7
•https://doi.org/10.1364/OIC.2016.ThB.7

SiO₂ Film Thickness Determination on Silicon Using Dual-Angle Imaging

Jennifer D. T. Kruschwitz and Roy S. Berns

Optical Interference Coatings 2016

Tucson, Arizona United States
19–24 June 2016
ISBN: 978-1-943580-13-2

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OIC 2016 Measurement Problem Results and Characterization (ThB)

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J. D. T. Kruschwitz and R. S. Berns, "SiO2 Film Thickness Determination on Silicon Using Dual-Angle Imaging," in Optical Interference Coatings 2016, OSA Technical Digest (online) (Optica Publishing Group, 2016), paper ThB.7.

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Abstract

Dual-angle imaging is a method that can be used to leverage color change versus incident angle to determine the physical thickness of a thin film using a digital camera.

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