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Conferences > OFC > 2021 > Th4A > Th4A.1

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate

T. Amano, A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, S. Suda, T. Kurosu, K. Takemura, T. Aoki, D. Shimura, Y. Onawa, and H. Yaegashi

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Abstract

We propose a next generation co-packaged substrate using Si photonics dies, a polymer optical waveguide, and a optical connector to achieve beyond 10 Tb/s and WDM optical links. The two micro-mirrors and polymer waveguides were integrated, and their optical characteristics were evaluated.

© 2021 The Author(s)

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