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Packaging and Assembly Challenges for 50G Silicon Photonics Interposers

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Abstract

We address the challenges in realizing low-loss, broadband optical interfaces for high-density fiber or polymer waveguides along with through-silicon via interconnects in a 50 GHz silicon photonics interposer platform suitable for 2.5D/3D packaging with advanced CMOS logic.

© 2018 The Author(s)

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