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Ultra-High Bandwidth InP IQ Modulator co-assembled with Driver IC for Beyond 100-GBd CDM

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Abstract

We fabricated a driver modulator sub assembly for beyond 100 GBd-CDM by employing an optimized electrode and a co-designed driver IC. The sub assembly exhibits an ultra-high bandwidth exceeding 67 GHz, which is sufficient for practical implementation.

© 2018 The Author(s)

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