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Conferences > OFC > 2017 > W3E > W3E.3

Hybrid III-V/Silicon Integration: Enabling the Next Generation of Advanced Photonic Transmitters

G. de Valicourt, C. M. Chang, M. S. Eggleston, A. Melikyan, C. Zhu, J. Lee, J. E. Simsarian, S. Chandrasekhar, J. Sinsky, K.W. Kim, A. Maho, R. Brenot, P. Dong, and Y. K. Chen

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Abstract

We review recent advances on hybrid III-V/Silicon devices using edge coupling. Design of external silicon cavities enables the realization of a broad range of on-chip functionalities as well as advanced hybrid transmitters.

© 2017 Optical Society of America

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