High-Throughput Photonic Packaging

Tymon Barwicz; Ted W. Lichoulas; Yoichi Taira; Yves Martin; Shotaro Takenobu; Alexander Janta-Polczynski; Hidetoshi Numata; Eddie L. Kimbrell; Jae-Woong Nah; Bo Peng; Robert Leidy; Marwan Khater; Swetha Kamlapurkar; Sebastian Engelmann; Paul Fortier; Nicolas Boyer

doi:10.1364/OFC.2017.Tu3K.4

Optical Fiber Communication Conference
OSA Technical Digest (online) (Optica Publishing Group, 2017),
paper Tu3K.4
•https://doi.org/10.1364/OFC.2017.Tu3K.4

High-Throughput Photonic Packaging

Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, and Nicolas Boyer

Optical Fiber Communication Conference 2017

Los Angeles, California United States
19–23 March 2017
ISBN: 978-1-943580-23-1

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Photonic Packaging (Tu3K)

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T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J. Nah, B. Peng, R. Leidy, M. Khater, S. Kamlapurkar, S. Engelmann, P. Fortier, and N. Boyer, "High-Throughput Photonic Packaging," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optica Publishing Group, 2017), paper Tu3K.4.

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Abstract

We have demonstrated photonic packaging compatible with standard, high-throughput, microelectronics assembly lines. We show a 1.3dB fiber-to-chip loss and 1.1dB chip-to-chip loss. We discuss the rationale behind this approach and compare to other packaging directions.

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