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Conferences > OFC > 2016 > Th3J > Th3J.3

3D Electro-Optical Integration Based on High-Performance Si Photonics TSV Interposer

Mingbin Yu, Yan Yang, Qing Fang, Xiaoguang Tu, Junfeng Song, King-Jien Chui, Rusli, and Guo-Qiang Lo

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Abstract

3D electro-optical integration based on a Cu-based Si-photonics TSV interposer has been demonstrated for integrated optical communication applications. The photonics TSV interposer consisting of monolithically integrated TSV, modulators and photodetectors, enabling a 30 Gbps-data-rate.

© 2016 Optical Society of America

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