Abstract

Multilane optics for high-density interconnects are available today in a variety of pluggable-transceiver and board-mounted packaging options. In order to support demand for thousands to tens of thousands of these modules per week, highly efficient packaging and manufacturing technologies are required that do not compromise performance. In the future, density and performance requirements as well as anticipated demand for such modules beyond hundreds of thousands of units per week will challenge existing capabilities. In this presentation, we explore historically successful packaging and assembly technologies and consider their applicability, as well as the applicability of new technologies, to next-generation high-density optical interconnects. Article not available.

© 2014 Optical Society of America