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Conferences > OFC > 2003 > TuE > TuE6
  • Optical Fiber Communication Conference
  • Technical Digest (Optica Publishing Group, 2003),
  • paper TuE6

Macroscopic and Microscopic Thermal Management of a Planar Integrated Optical Device

T. Spott, A. Schumacher, J. Dieckroeger, D. Krabe, W. Schenk, H. Schneider, S. Ramminger, and I. Baumann

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Abstract

We present a detailed concept for microscopic and macroscopic thermal management of a planar, integrated optical device. Deep-etched grooves minimize the power consumption of thermo-optical switches. The layout minimize thermal crosstalk between different components.

© 2003 Optical Society of America

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