Demonstration of 2-D Plastic Optical Fibre based optical interconnect between CMOS IC’s

L. Vanwassenhove; R. Bockstaele; R. Baets; M. Brunfaut; W. Meeus; J. Van Campenhout; J. Hall; H. Melchior; A. Neyer; J. Van Koetsem; R. King; K. Ebeling; P. Heremans

doi:10.1364/OFC.2001.WDD74

Optical Fiber Communication Conference and International Conference on Quantum Information
2001 OSA Technical Digest Series (Optica Publishing Group, 2001),
paper WDD74
•https://doi.org/10.1364/OFC.2001.WDD74

Demonstration of 2-D Plastic Optical Fibre based optical interconnect between CMOS IC’s

L. Vanwassenhove, R. Bockstaele, R. Baets, M. Brunfaut, W. Meeus, J. Van Campenhout, J. Hall, H. Melchior, A. Neyer, J. Van Koetsem, R. King, K. Ebeling, and P. Heremans

Optical Fiber Communication Conference 2001

Anaheim, California United States
ISBN: 1-55752-654-0

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L. Vanwassenhove, R. Bockstaele, R. Baets, M. Brunfaut, W. Meeus, J. Van Campenhout, J. Hall, H. Melchior, A. Neyer, J. Van Koetsem, R. King, K. Ebeling, and P. Heremans, "Demonstration of 2-D Plastic Optical Fibre based optical interconnect between CMOS IC’s," in Optical Fiber Communication Conference and International Conference on Quantum Information, 2001 OSA Technical Digest Series (Optica Publishing Group, 2001), paper WDD74.

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Abstract

The design and fabrication of a digital system demonstrator implementing 2D optical interconnect via a POF ribbon will be discussed. This demonstrator implements 256 optical I/O channels per chip. Each chip, a custom FPGA CMOS design, implements digital and analogue functionality.

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