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  • Conference on Optical Fiber Communications
  • 1997 OSA Technical Digest Series (Optica Publishing Group, 1997),
  • paper WL58

Low-cost pigtailed PIN module with a novel solvent-bonding technique

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Abstract

Conventional adhesive bonding involves an organic compound such as an epoxy or UV cure resin to bond two or more surfaces permanently.

© 1997 Optical Society of America

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