This paper describes the design features and performance of a circuit pack to backplane multifiber optical connector capable of interconnecting up to 18 fibers through the backplane of an electronic hardware packaging system. Although designed for the AT&T FASTECH™1 system, it is compatible with other backplane type systems. The connector uses precision etched V-groove silicon chips to mass terminate the fibers. The fibers are epoxy bonded between two chips; this forms a rectangular assembly called an array. This proven epoxy bonded chip technology is used by AT&T for splicing both multimode and single mode ribbon fiber.
© 1986 Optical Society of AmericaPDF Article