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Conferences > OECC_PS > 2013 > TuN4 > TuN4_2
  • 2013 18th OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching
  • (Optica Publishing Group, 2013),
  • paper TuN4_2
  • •https://doi.org/10.1364/OECC_PS.2013.TuN4_2

High-density Optical Interposers Fully Integrated with Silicon Photonics

Y. Urino, J. Fujikata, T. Usuki, M. Ishizaka, K. Yamada, T. Horikawa, T. Nakamura, and Y. Arakawa

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Abstract

High-density optical interposers integrated with complete optical components on single silicon substrate by using silicon photonics were demonstrated. Error-free data transmission at 12.5-Gbps and high bandwidth density of 6.6-Tbps/cm2 were achieved with the optical interposers.

© 2013 IEICE

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