Prospects and Challenges of High-Density Heterogeneous Photonic Integration

S. J. B. Yoo

doi:10.1364/OECC_PS.2013.TuN4_1

2013 18th OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching
(Optica Publishing Group, 2013),
paper TuN4_1
•https://doi.org/10.1364/OECC_PS.2013.TuN4_1

Prospects and Challenges of High-Density Heterogeneous Photonic Integration

S. J. B. Yoo

OptoElectronics and Communications Conference and Photonics in Switching 2013

Kyoto Japan
30 June–4 July 2013
ISBN: 978-4-88552-271-0

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High-density Photonic Integration Platforms and their Applications (Application) (TuN4)

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S. J. B. Yoo, "Prospects and Challenges of High-Density Heterogeneous Photonic Integration," in 2013 18th OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching, (Optica Publishing Group, 2013), paper TuN4_1.

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Abstract

We will review the progress and impact of photonic integration, and address the progress, challenges, and future prospects of photonic-electronic integration in future information systems. Technologies include silicon CMOS photonics and InP, GaAs OEICs.

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