Dense CMOS-Photonics Integration in sub-100nm Technology Node

Solomon Assefa; Steven Shank; William M. J. Green; Alexander Rylyakov; Clint Schow; Marwan Khater; Swetha Kamlapurkar; Edward Kiewra; Carol Reinholm; Yurii Vlasov

doi:10.1364/OECC_PS.2013.TuN2_1

2013 18th OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching
(Optica Publishing Group, 2013),
paper TuN2_1
•https://doi.org/10.1364/OECC_PS.2013.TuN2_1

Dense CMOS-Photonics Integration in sub-100nm Technology Node

Solomon Assefa, Steven Shank, William M. J. Green, Alexander Rylyakov, Clint Schow, Marwan Khater, Swetha Kamlapurkar, Edward Kiewra, Carol Reinholm, and Yurii Vlasov

OptoElectronics and Communications Conference and Photonics in Switching 2013

Kyoto Japan
30 June–4 July 2013
ISBN: 978-4-88552-271-0

From the session
High-density Photonic Integration Platforms and their Applications (Silicon) (TuN2)

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S. Assefa, S. Shank, W. M. J. Green, A. Rylyakov, C. Schow, M. Khater, S. Kamlapurkar, E. Kiewra, C. Reinholm, and Y. Vlasov, "Dense CMOS-Photonics Integration in sub-100nm Technology Node," in 2013 18th OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching, (Optica Publishing Group, 2013), paper TuN2_1.

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Abstract

A sub-100nm technology that allows the monolithic integration of optical devices as features into a 90nm base high-performance logic technology node is demonstrated. The technology is promising for next generation optical communications for applications.

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