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Electro-Optical Printed Circuit Board (EO-PCB) Device Connectivity Enables Greater Application Execution Efficiency

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Abstract

The use of an Electro-Optical integrated Printed Circuit Board (EO-PCB) enables the interconnect of multiple fiber optic channels between devices utilizing a hybrid optical and copper Ball Grid Array (BGA) package. This higher bandwidth optical interconnect dramatically improves the efficiency of resident application programs.

© 2003 Optical Society of America

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