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Conferences > OC > 1999 > PD > PD3

16×16 VCSEL Array Flip-chip bonded to CMOS VLSI Circuit

A. V. Krishnamoorthy, K. W. Goossen, L M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, and L.A D'Asaro

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Abstract

We have flip-chip bonded a 16×16 array of 970nm VCSELs to a Silicon CMOS circuit. The device yield after bonding and packaging of the Optoelectronic-VLSI chip is approximately 96%. Individual VCSELs are capable of modulated by the circuit at IGbit/s. Parallel testing of 80VCSELs at IGbit/s per VCSEL is presented.

© 1999 Optical Society of America

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