Abstract

For the first time an optical self-aligned flip-chip packaging technique for tilted amplifier arrays using Si V-grooves and angle polished fiber arrays with fiber-to-fiber gain of 8±1 dB and ripple < 0.2 dB is demonstrated.

© 1994 Optical Society of America

PDF Article
More Like This
OEIC Packaging with Self-aligned Fiber to Waveguide Array Coupling by Si V-groove Flip-Chip Technique

W. Hunziker, W. Vogt, and H. Melchior
SaC3 Integrated Photonics Research (IPR) 1994

Demonstration of Self-Aligned Flip-Chip Photonic Assembly with 1.1dB Loss and >120nm Bandwidth

Tymon Barwicz, Yves Martin, Jae-Woong Nah, Swetha Kamlapurkar, Robert L. Bruce, Sebastian Engelmann, and Yurii A. Vlasov.
FF5F.3 Frontiers in Optics (FiO) 2016

Thermal Design of Uncooled Edge Emitting InP Laser Array Package using Silicon Optical Bench Technology

Yiu-man Wong, Fred Warning, and John Zilko
SaE2 Integrated Photonics Research (IPR) 1994

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription