Self-aligned Tilted Amplifier Array Packaging using Si V-groove Flip-Chip Technique for Gate Array Applications

W. Hunziker; W. Vogt; H. Melchior; Ph. Brosson; P. Doussiere; T. Fillion; G. Gelly; J-L. Gentner; D. Leclerc; R. Ngo; A. Pinquier; F. Pommereau; J-G. Provost; J-F. Vinchant

doi:10.1364/OAA.1994.PD4

Optical Amplifiers and Their Applications
1994 OSA Technical Digest Series (Optica Publishing Group, 1994),
paper PD4
•https://doi.org/10.1364/OAA.1994.PD4

Self-aligned Tilted Amplifier Array Packaging using Si V-groove Flip-Chip Technique for Gate Array Applications

W. Hunziker, W. Vogt, H. Melchior, Ph. Brosson, P. Doussiere, T. Fillion, G. Gelly, J-L. Gentner, D. Leclerc, R. Ngo, A. Pinquier, F. Pommereau, J-G. Provost, and J-F. Vinchant

Optical Amplifiers and Their Applications 1994

Breckenridge, Colorado United States
ISBN: 1-55752-356-8

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W. Hunziker, W. Vogt, H. Melchior, P. Brosson, P. Doussiere, T. Fillion, G. Gelly, J. Gentner, D. Leclerc, R. Ngo, A. Pinquier, F. Pommereau, J. Provost, and J. Vinchant, "Self-aligned Tilted Amplifier Array Packaging using Si V-groove Flip-Chip Technique for Gate Array Applications," in Optical Amplifiers and Their Applications, Vol. 14 of 1994 OSA Technical Digest Series (Optica Publishing Group, 1994), paper PD4.

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Abstract

For the first time an optical self-aligned flip-chip packaging technique for tilted amplifier arrays using Si V-grooves and angle polished fiber arrays with fiber-to-fiber gain of 8±1 dB and ripple < 0.2 dB is demonstrated.

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