Abstract
24-channel 850-nm VCSEL and PD arrays are flip-chip soldered to 90-nm CMOS “holey” 48-channel 12.5-Gb/s/channel transceiver chip, featuring through-substrate holes for optical I/O. Aggregate 300-Gb/s bi-drectional data rate is highest reported for single-chip transceiver modules.
© 2010 IEEE Communications Society, IEEE Photonics Society, OSA, Telcordia
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