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Sharper and Dipper Laser Beam Shaping for Super-Resolved Imaging in Silicon

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Abstract

Enhanced laser beam shaping for super-resolved imaging in silicon is demonstrated by applying pico-seconds pulsed pump at 775nm having increased penetration-depth into the silicon (than pump at 532nm) and yielding sharper PSF due to reduced diffusion effect of the generated free-charge-carriers.

© 2019 The Author(s)

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