Measuring the temperature of LED chips encapsulated by transparent silicone rubber

Te-yuan Chung; Yong-Siang Hsu; Ting-Wei Liang

doi:10.1364/FIO.2019.JW3A.7

Frontiers in Optics + Laser Science APS/DLS
OSA Technical Digest (Optica Publishing Group, 2019),
paper JW3A.7
•https://doi.org/10.1364/FIO.2019.JW3A.7

Measuring the temperature of LED chips encapsulated by transparent silicone rubber

Te-yuan Chung, Yong-Siang Hsu, and Ting-Wei Liang

Laser Science 2019

Washington, DC United States
15–19 September 2019
ISBN: 978-1-943580-67-5

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Poster Session III (JW3A)

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T. Chung, Y. Hsu, and T. Liang, "Measuring the temperature of LED chips encapsulated by transparent silicone rubber," in Frontiers in Optics + Laser Science APS/DLS, OSA Technical Digest (Optica Publishing Group, 2019), paper JW3A.7.

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Abstract

Silicone rubber has a transparent window in 3.6-4.5 μm. Therefore, the thermal radiation of high power LED encapsulated by transparent silicone rubber can be measured through this window. The corresponding temperature can then be estimated.

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