Estimation of Dielectric Constant and Thickness of Copper Thin Films Using Surface Plasmon Resonance

Nicolás Manrique; Henry Riascos

doi:10.1364/LAOP.2018.Th4A.16

Latin America Optics and Photonics Conference
OSA Technical Digest (Optica Publishing Group, 2018),
paper Th4A.16
•https://doi.org/10.1364/LAOP.2018.Th4A.16

Estimation of Dielectric Constant and Thickness of Copper Thin Films Using Surface Plasmon Resonance

Nicolás Manrique and Henry Riascos

Latin America Optics and Photonics Conference 2018

Lima Peru
12–15 November 2018
ISBN: 978-1-943580-49-1

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Poster Session II (Th4A)

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N. Manrique and H. Riascos, "Estimation of Dielectric Constant and Thickness of Copper Thin Films Using Surface Plasmon Resonance," in Latin America Optics and Photonics Conference, OSA Technical Digest (Optica Publishing Group, 2018), paper Th4A.16.

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Abstract

This work shows a procedure in which the surface Plasmon resonance phenomena based on attenuated total reflection method was used to determine the dielectric constant and an approximate thickness of two thin copper (Cu) films.

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