The diameter and depth of a through-silicon via were measured using a spectral-domain interferometer combined with a confocal microscope. Through the uncertainty analysis and comparative measurements, the measurement performance of both quantities was evaluated.

© 2016 Optical Society of America

PDF Article


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription