Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration

C. Koos; C. Koos; W. Freude; W. Freude; J. Leuthold; N. Lindenmann; N. Lindenmann; S. Koeber; S. Koeber; J. Hoffmann; T. Hoose; T. Hoose; P. Huebner; M. R. Billah; M. R. Billah

doi:10.1364/IPRSN.2013.IM4A.3

Advanced Photonics 2013
OSA Technical Digest (online) (Optica Publishing Group, 2013),
paper IM4A.3
•https://doi.org/10.1364/IPRSN.2013.IM4A.3

Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration

C. Koos, W. Freude, J. Leuthold, N. Lindenmann, S. Koeber, J. Hoffmann, T. Hoose, P. Huebner, and M. R. Billah

Integrated Photonics Research, Silicon and Nanophotonics 2013

Rio Grande, Puerto Rico United States
14–17 July 2013
ISBN: 978-1-55752-981-7

From the session
Recent Developments in Silicon Photonics Symposium II (IM4A)

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C. Koos, W. Freude, J. Leuthold, N. Lindenmann, S. Koeber, J. Hoffmann, T. Hoose, P. Huebner, and M. R. Billah, "Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration," in Advanced Photonics 2013, H. Chang, V. Tolstikhin, T. Krauss, and M. Watts, eds., OSA Technical Digest (online) (Optica Publishing Group, 2013), paper IM4A.3.

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Abstract

Photonic wire bonding enables advanced multi-chip assemblies that combine the specific strengths of different photonic integration platforms. The technique is based on in-situ fabrication of 3D freeform waveguides by two-photon polymerization. We introduce the concept and show first experimental demonstrations.

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