Abstract

Recent advances of the Micro-Electro-Mechanical System (MEMS) technology has opened up many new opportunities for packaging of optoelectronic components. Silicon V-grooves are now widely used in fiber and optoelectronic packages. New dry etching and electroplating technique allows the fabrication of high-aspect-ratio structures. Furthermore, MEMS actuators and micropositioners enables new packaging schemes. Micro-XYZ stages with sub-micrometer accuracy permit on-chip optical alignment for advanced optoelectronic packages. In this paper, we will review the current state-of-the-art of the MEMS technologies, and discuss examples of MEMS-enabled optoelectronic packaging schemes

© 1998 Optical Society of America

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