Abstract

A low cost passive alignment of laser array chips to multimode optical fibers has been reported1 recently using flip-chip bump bonding and silicon optical bench technology. The thermal design for AuSn and PbSn solders of different dimensions has been reported2. However, in flip-chip bonding of a laser array with the p+ active side down, two practical issues have been identified and will be addressed in this paper.

© 1994 Optical Society of America

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References

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