Abstract

This paper provides a basic understanding of the trade-offs that have to be managed in the design and manufacturing of telecommunication laser modules for two different applications: high performance and low cost / high volume applications. Fundamental design considerations and future manufacturing process breakthroughs required to meet market demands are discussed. Also, the major production steps and their corresponding cost trends through the decade are presented. Applications will drive both new semiconductor devices and new packaging manufacturing processes. However, our conclusion from the above considerations is that high volume packaging processes require extensive development to allow mass production and to permit full utilization of photonic technology by customers.

© 1994 Optical Society of America