Development of Integrated Photonic Packaging Standards and Foundry Capabilities

Peter O’Brien

doi:10.1364/FIO.2016.FF3E.2

Frontiers in Optics 2016
OSA Technical Digest (online) (Optica Publishing Group, 2016),
paper FF3E.2
•https://doi.org/10.1364/FIO.2016.FF3E.2

Development of Integrated Photonic Packaging Standards and Foundry Capabilities

Peter O’Brien

Frontiers in Optics 2016

Rochester, New York United States
17–21 October 2016
ISBN: 978-1-943580-19-4

From the session
Symposium on Integrated Photonic Manufacturing II (FF3E)

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P. O’Brien, "Development of Integrated Photonic Packaging Standards and Foundry Capabilities," in Frontiers in Optics 2016, OSA Technical Digest (online) (Optica Publishing Group, 2016), paper FF3E.2.

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Abstract

An overview of Si and InP PIC packaging standards and foundry capabilities led by researchers at the Tyndall Institute in collaboration with European partners will be presented. Details of optical and electrical packaging techniques will be reviewed.

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