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Providing Silicon-Photonic Transceivers with an Efficient Laser Source: Where does “III-V/Silicon Heterogeneous Integration” Stand?

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Abstract

Packaging of finished III-V-chips (SOAs and DFB Lasers) is the strategy adopted for providing Si-Photonic-transceivers with a laser source. With the capability for increased integration and reduced cost, where does heterogeneous-integration stand?

© 2016 Optical Society of America

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