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Conferences > ECOC > 2011 > We.9.LeSaleve > We.9.LeSaleve.4

First Demonstration of High Density Optical Interconnects Integrated with Lasers, Optical Modulators and Photodetectors on a Single Silicon Substrate

Yutaka Urino, Takanori Shimizu, Makoto Okano, Nobuaki Hatori, Masashige Ishizaka, Tsuyoshi Yamamoto, Takeshi Baba, Takeshi Akagawa, Suguru Akiyama, Tatsuya Usuki, Daisuke Okamoto, Makoto Miura, Masataka Noguchi, Junichi Fujikata, Daisuke Shimura, Hideaki Okayama, Tai Tsuchizawa, Toshifumi Watanabe, Koji Yamada, Seiichi Itabashi, Emiko Saito, Takahiro Nakamura, and Yasuhiko Arakawa

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Abstract

Optical interconnects integrated with lasers, silicon optical modulators and germanium photodetectors on a single silicon substrate were demonstrated for the first time. A 5 Gbps line bit rate and 3.5 Tbps/cm2 transmission density were achieved.

© 2011 Optical Society of America

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